![Click the picture to see more about our products.](../../lk/upfile/l001s.jpg) |
![](../../lk/upfile/200464158423594.jpg) |
¡¤Wholly new omnipotent combination,easy to use. ¡¤Heating upward and downward,Suitable for desoldering BGA ICs. ¡¤Angle djustable according to different sizes of PCBs. |
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ID£ºL001 |
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![Click the picture to see more about our products.](../../lk/upfile/l002s.jpg) |
![](../../lk/upfile/l002t.jpg) |
¡¤Unique chip-control circuit able to ccurately control temperature with a error of ¡æ,able to stabilize the temperature regardless the volume of the air flow. ¡¤Unique touch switch system,easy for temperature control. ¡¤Automatic cooling system.prolonged airflow after shutdown. Automatic shutdown when temperature is lowew than 50¡æ to protect the heater and handle. ¡¤Automatic temperature control,high-speed heating,automatic standby when temperatre reaches the preset degree. |
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ID£ºL002 |
QTY/BOX |
MEAS cm |
N.W/G.W kg |
4 |
61¡Á34¡Á41 |
16/17 |
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![Click the picture to see more about our products.](../../lk/upfile/l003s.jpg) |
![](../../lk/upfile/200464159363886.jpg) |
¡¤High-speed heating,temperature can be raised as high as 250¡æ in 10 seconds. ¡¤In-bed temperature sensor to stabilize tmperature output. ¡¤Able to output both hot and cool air for different uses. ¡¤Able to hande BGA and ICs in other shapes when used with welding machine. |
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ID£ºL003 |
QTY/BOX |
MEAS cm |
N.W/G.W kg |
4 |
25.5¡Á18.5¡Á35 |
4.5/5 |
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![Click the picture to see more about our products.](../../lk/upfile/l004s.jpg) |
![](../../lk/upfile/l004t.jpg) |
¡¤Combination working station,convenient for use. ¡¤Free to move to ensure effective distance for BGA soldering. ¡¤Able to heat from both upside and downside specially suitable forhandling BGA chip. ¡¤Adjustable according to the size of the circuit board.
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ID£ºL004 |
QTY/BOX |
MEAS cm |
N.W/G.W kg |
4 |
40¡Á28¡Á58 |
16/17 |
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![Click the picture to see more about our products.](../../lk/upfile/l005s.jpg) |
![](../../lk/upfile/l005t.jpg) |
¡¤Combination working station,convenient for use. ¡¤Free to move to ensure effective distance for BGA soldering. ¡¤Able to heat from both upside and downside specially suitable for handling BGA chip. ¡¤Adjustable according to the size of the circuit board.
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ID£ºL005 |
QTY/BOX |
MEAS cm |
N.W/G.W kg |
4 |
40¡Á28¡Á58 |
16/17 |
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